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Autor(en):
Mangold, T.; Wolf, J.; Toepper, M.; Reichl, H.; Russer, P. 
Titel:
A Multichip Module Integration Technology for High-Speed Analog and Digital Applications 
Abstract:
We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected thru a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered/electroplated copper wiring on ceramic or silicon substrate. Polyimid PyralintextlesssuptextgreaterTMtextless/suptextgreater (2722 (Du Pont) and CyclotenetextlesssuptextgreaterTMtextless/suptextgr...    »
 
Stichworte:
analog circuit, ceramic substrate, Cu, Cyclotene, digital circuit, electromagnetic full-wave model, electroplated copper wiring, embedded system, equivalent circuit, equivalent circuits, high-speed circuit, high-speed integrated circuits, integrated circuit technology, interlevel dielectric, MCM-D, metallization, multichip modules, Parameter extraction, planar multichip module integration technology, Polyimid Pyralin, polymer film, silicon substrate, sputtered copper wiring, thin film multilayer...    »
 
Kongress- / Buchtitel:
URSI International Symposium on Signals, Systems, and Electronics (ISSSE) 
Verlagsort:
Pisa, Italy 
Jahr:
1998 
Monat:
sep 
Seiten:
91--96