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- Document type:
- Konferenzbeitrag
- Author(s):
- Sedivy, O.; Krempaszky, C.; Holy, S.
- Title:
- Residual Stress Measurement by Electronic Speckle Pattern Interferometry
- Book / Congress title:
- Proceedings of 5th Australasian Congress on Applied Mechanics
- Publisher address:
- Brisbane
- Year:
- 2007
- TUM Institution:
- Lehrstuhl für Werkstoffkunde und Werkstoffmechanik
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