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- Document type:
- Konferenzbeitrag
- Author(s):
- Sedivy, O.; Krempaszky, C.; Holy, S.
- Title:
- Electronic Speckle Pattern Interferometry Measurement of Residual Stress
- Book / Congress title:
- Proc. 25th Danubia-Adria Symposium on Advances in Experimental Mechanics
- Publisher address:
- Budweis, CZ
- Year:
- 2008
- Pages:
- 229-230
- Covered by:
- Scopus
- TUM Institution:
- Lehrstuhl für Werkstoffkunde und Werkstoffmechanik
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