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Document type:
Konferenzbeitrag 
Author(s):
Sedivy, O.; Krempaszky, C.; Holy, S. 
Title:
Electronic Speckle Pattern Interferometry Measurement of Residual Stress 
Book / Congress title:
Proc. 25th Danubia-Adria Symposium on Advances in Experimental Mechanics 
Publisher address:
Budweis, CZ 
Year:
2008 
Pages:
229-230 
Covered by:
Scopus 
TUM Institution:
Lehrstuhl für Werkstoffkunde und Werkstoffmechanik