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- Autor(en):
- Vahldieck, R.; Chen, S.; Jin, H.; Electronicsr, P. RuSOptics Lettersid-State
- Titel:
- Flip--Chip and Bond Wire/Airbridge Transition between Passive Microwave Transmission Lines and Laser Diodes
- Kongress- / Buchtitel:
- 25th European Microwave Conference, BOptics Lettersogna, 4. -- 7.9.95
- Jahr:
- 1995
- Monat:
- September
- Seiten:
- 875--877
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