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Author(s):
Lukashevich, Dzianis; Vietzorreck, Larissa; Russer, Peter 
Title:
Numerical Investigation of Transmission Lines and Components in Damascene Technology 
Abstract:
The development of multilayered, highly integrated circuit boards using damascene technology and copper as a conductor material is a promising way to achieve small and compact modules with high functionality. As copper as conductor can carry much higher current densities as aluminium, the size of transmission lines can be reduced down to a minimum value of 2.5 ¿m in width and 0.4 ¿m height. Different types of lines can be developed in this technology. Due to the small dimensions comparable to...    »
 
Book / Congress title:
32nd European Microwave Conference (EuMA) 
Publisher address:
Milan, Italy 
Year:
2002 
Month:
sep 
Pages:
1--4