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Document type:
Konferenzbeitrag
Contribution type:
Textbeitrag / Aufsatz
Author(s):
Cangellaris, A. C.; Russer, J. A.
Title:
EMI/EMC modeling of packaged electronics: Challenges and opportunities
Abstract:
Print Request Permissions Save to Project The complexity of EMI/EMC modeling at the package, board and system level of multifunctional electronic designs necessitates the use of approximations in the development of a manageable computer model. Such approximations can be interpreted in terms of geometric, material, and layout variability. This variability, which is also relevant to uncertainties in floor-planning, layout and operating condi...     »
Book / Congress title:
General Assembly and Scientific Symposium 2011, XXXth URSI
Congress (additional information):
Istanbul, Turkey, Aug 13 - 20, 2011
Publisher:
IEEE Xplore Digital Library
Year:
2011
Quarter:
3. Quartal
Year / month:
2011-08
Month:
Aug
Pages:
1 - 4
Reviewed:
ja
Language:
en
Publication format:
Print
Fulltext / DOI:
doi:10.1109/URSIGASS.2011.6050760
WWW:
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6050760
Format:
Text
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